Eyeq4 Datasheet -

| Revision | Date | Changes | |----------|------------|----------------------------------| | 1.0 | 2018-08-01 | Initial production datasheet | | 1.1 | 2019-02-10 | Added REM support, power numbers | | 1.2 | 2020-05-22 | Updated temp range, ESD ratings |

: Powers critical functions such as Autonomous Emergency Braking (AEB), Pedestrian AEB, and Forward Collision Warning (FCW). Driving Policy

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28nm Fully Depleted Silicon On Insulator (FD-SOI) by STMicroelectronics Up to 8 cameras simultaneously at 36 FPS Safety Standard ISO 26262 compliant with ASIL-B(D) safety level Packaging Flip-Chip FBGA 784-pin; 22.5 x 22.5 x 1.7 mm EyeQ4 Variant Differences

The EyeQ4 datasheet is a comprehensive document that provides an in-depth look at the specifications, features, and applications of the EyeQ4, a system-on-chip (SoC) designed by Mobileye, a leading company in the field of autonomous driving and artificial intelligence (AI). The EyeQ4 is a fourth-generation SoC that enables advanced driver-assistance systems (ADAS) and autonomous driving capabilities in various industries, including automotive, industrial, and robotics. eyeq4 datasheet

Capable of 360-degree environmental perception when utilized in multi-camera configurations (such as tri-cam setups).

: Implements 6 VMP cores . These function as Very Long Instruction Word (VLIW) and Single Instruction Multiple Data (SIMD) vector machines optimized for short integral datatypes common in vision algorithms and neural network operations.

L1 (Driver Assistance), L2 (Partial Automation), and L3 (Conditional Automation).

: The chip provides standard driver alerts, including: L1 (Driver Assistance), L2 (Partial Automation), and L3

The EyeQ4 is fabricated using advanced semiconductor technologies engineered specifically for the thermal and durability demands of the automotive ecosystem. Specification Details 28nm Fully Depleted Silicon On Insulator (FD-SOI) Deep Learning Compute 2.5 TOPS (Tera Operations Per Second) Typical SoC Power Package Type Flip-Chip FBGA 784-pin Package Physical Dimensions 22.5 mm × 22.5 mm × 1.7 mm Ball Pitch ASIL Certification Targets up to ASIL-B / ASIL-D system implementation Fabrications and Power Efficiency Benefits

The EyeQ4 is designed for seamless integration into a vehicle's network.

Designed from the ground up to meet ASIL (Automotive Safety Integrity Level) standards. Hardware failure detection mechanisms, such as error-correcting code (ECC) on all internal memories and registers, catch potential data corruption.

: A cost-optimized variant with a subset of cores, typically used for monocular or trifocal camera configurations in standard ADAS applications. Key Interfaces and Connectivity compact camera modules.

Developed by Mobileye and manufactured by STMicroelectronics using 28nm FD-SOI (Fully Depleted Silicon On Insulator) technology, which helps maintain low power consumption despite high performance.

When integrating computational hardware into vehicle camera housings (such as the ZF S-Cam4 mounted behind the rearview mirror), form factor is highly critical.

Accommodates variable road profile reconstructions, path planning over construction zones, and localized lane boundaries.

This efficiency stems directly from the use of the 28nm FD-SOI process and its purpose-built architecture. The result is that the EyeQ4 is ten times more powerful than the EyeQ3 while consuming only about 20% more energy. This low power draw simplifies thermal management and is a key enabler for cost-effective, compact camera modules.